Water Dust Resistant: LG Teases LG G6 in Video Promos

LG has been releasing teasers for their upcoming flagship LG G6 for the past month. Starting with video promos in January teasing an ‘Ideal Smartphone’ and continuing with snippets focusing on features such as ‘More Intelligence’, ‘More Juice’, and ‘More Reliability’. Recently, LG has released new video teasers hinting at another feature of the device.

Water Dust Resistant: LG Teases LG G6 in Video Promos – Overview

The initially confusing short videos named “Pool” and “Flour” reveal a clear message when you connect the dots: the outline of the LG G6 is drawn at the end, indicating one of its main features will be water and dust resistance, likely with an IP67 or IP68 rating. A recent promo hinted at this with the tagline ‘Resist More, Under Pressure’. The trend of flagship smartphones featuring water and dust resistance is a positive step, explaining the non-removable battery of the LG G6.

LG is set to unveil the LG G6 at MWC on February 26. With numerous leaks and updates circulating, the anticipation for what surprise LG will unveil at the event is high. The device will be released in the South Korean market on March 10 and in the USA on April 7. LG aims to capitalize on Samsung’s flagship absence in the market and attract more sales. The success of this strategy will rely not only on marketing but also on the features that will entice loyal Samsung fans to consider trying out an LG smartphone.

Dive into the world of innovative durability as LG tantalizingly teases the water and dust resistance of the LG G6 through engaging video promos. Immerse yourself in the exciting realm of rugged technology and stay tuned for an in-depth exploration of the smartphone’s robust features that ensure protection against the elements. Join us on a journey of discovery as we unveil the reliability and performance of the LG G6, setting the standard for resilient and enduring mobile devices.

Feel free to ask questions concerning this post by writing in the comment section below.

About The Author

Reply

error: Content is protected !!